Adhesion in Microelectronics 1st Edition by K. L. Mittal, Tanweer Ahsan – Ebook PDF Instant Download/Delivery: 978-1118831342, 1118831342
Full download Adhesion in Microelectronics 1st Edition after payment

Product details:
ISBN 10: 1118831342
ISBN 13: 978-1118831342
Author: K. L. Mittal, Tanweer Ahsan
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;
- Various theories or mechanisms of adhesion
- Surface (physical or chemical) characterization of materials as it pertains to adhesion
- Surface cleaning as it pertains to adhesion
- Ways to improve adhesion
- Unraveling of interfacial interactions using an array of pertinent techniques
- Characterization of interfaces / interphases
- Polymer-polymer adhesion
- Metal-polymer adhesion (metallized polymers)
- Polymer adhesion to various substrates
- Adhesion of thin films
- Adhesion of underfills
- Adhesion of molding compounds
- Adhesion of different dielectric materials
- Delamination and reliability issues in packaged devices
- Interface mechanics and crack propagation
- Adhesion measurement of thin films and coatings
Table of contents:
Part 1: Adhesion: Fundamentals and Measurement
-
Study of Molecular Bonding or Adhesion by Inelastic Electron Tunneling Spectroscopy, with Special Reference to Microelectronics
-
Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics
Part 2: Ways to Promote/Enhance Adhesion
-
Tailoring of Interface/Interphase to Promote Metal-Polymer Adhesion
-
Atmospheric and Vacuum Plasma Treatments of Polymer Surfaces for Enhanced Adhesion in Microelectronics Packaging
-
Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications
Part 3: Reliability and Failure Mechanisms
-
Role of Adhesion Phenomenon in the Reliability of Electronic Packaging
-
Delamination and Reliability Issues in Packaged Devices
-
Investigation of the Mechanisms of Adhesion and Failure in Microelectronic Packages
People also search for:
forager’s table
forager temples
the forager puzzles
the forager’s harvest pdf
the forager’s harvest
Tags: Mittal, Tanweer Ahsan, Adhesion in Microelectronics


