Handbook of Semiconductor Manufacturing Technology 2nd Edition by Yoshio Nishi, Robert Doering ISBN 978-1574446753 1574446754

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Product details: 

ISBN 10: 1574446754

ISBN 13: 978-1574446753

Author:  Yoshio Nishi, Robert Doering 

Retaining the comprehensive and in-depth approach that cemented the bestselling first edition’s place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today’s most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world’s leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available.

Stay Current with the Latest Technologies
In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on…

Silicon-on-insulator (SOI) materials and devices
Supercritical CO2 in semiconductor cleaning
Low-κ dielectrics
Atomic-layer deposition
Damascene copper electroplating
Effects of terrestrial radiation on integrated circuits (ICs)

Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication.

While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
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Table of contents: 

Chapter 1: Introduction to Semiconductor Devices
Chapter 2: Overview of Interconnect – Copper and Low-k Integration
Chapter 3: Silicon Materials
Chapter 4: SOI Materials and Devices
Chapter 5: Surface Preparation
Chapter 6: Supercritical Carbon Dioxide in Semiconductor Cleaning
Chapter 7: Ion Implantation
Chapter 8: Dopant Diffusion
Chapter 9: Oxidation and Gate Dielectrics
Chapter 10: Silicides
Chapter 11: Rapid Thermal Processing
Chapter 12: Low-k Dielectrics
Chapter 13: Chemical Vapor Deposition
Chapter 14: Atomic Layer Deposition
Chapter 15: Physical Vapor Deposition
Chapter 16: Damascene Copper Electroplating
Chapter 17: Chemical–Mechanical Polishing
Chapter 18: Optical Lithography
Chapter 19: Photoresist Materials and Processing
Chapter 20: Photomask Fabrication
Chapter 21: Plasma Etch
Chapter 22: Equipment Reliability
Chapter 23: Overview of Process Control
Chapter 24: In-Line Metrology
Chapter 25: In-Situ Metrology
Chapter 26: Yield Modeling
Chapter 27: Yield Management
Chapter 28: Electrical, Physical, and Chemical Characterization
Chapter 29: Failure Analysis
Chapter 30: Reliability Physics and Engineering
Chapter 31: Effects of Terrestrial Radiation on Integrated Circuits
Chapter 32: Integrated-Circuit Packaging
Chapter 33: 300 mm Wafer Fab Logistics and Automated Material Handling Systems
Chapter 34: Factory Modeling
Chapter 35: Economics of Semiconductor Manufacturing

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Tags: Yoshio Nishi, Robert Doering, Handbook of Semiconductor, Manufacturing Technology