Area Array Packaging Handbook Manufacturing and Assembly 1st Edition by Ken Gilleo ISBN 0071374930 9780071374934

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Product details: 

ISBN 10: 0071374930 

ISBN 13: 9780071374934

Author:  Ken Gilleo

*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)

Table of contents: 

1. Foreword

Section 1: Packaging Concepts and Design
2. Chapter 1: Introduction to Electronic Packaging
3. Chapter 2: Electronics Industry Overview
4. Chapter 3: Trends/Drivers in the Electronics Manufacturing Industry
5. Chapter 4: Area Array Packaging
6. Chapter 5: Stacked/3D Packages
7. Chapter 6: Compliant IC Packaging
8. Chapter 7: Flip Chip Technology
9. Chapter 8: Options in High-Density Part Cleaning
10. Chapter 9: MEMS Packaging and Assembly Challenges
11. Chapter 10: Ceramic Ball and Column Grid Array Overview

Section 2: Materials
12. Chapter 11: Polymer Packaging Materials: Adhesives, Encapsulants, and Underfills
13. Chapter 12: Hermetic Packaging Systems: Adhesive and Getter
14. Chapter 13: Area Array Solder Spheres, Pastes, and Fluxes
15. Chapter 14: Modern Solder and Solder Paste
16. Chapter 15: Lead-Free Systems and Process Implications
17. Chapter 16: Electrically Conductive Adhesives for Surface-Mount and Flip Chip Processes: An Alternative to Solder?

Section 3: Equipment and Processes
18. Chapter 17: Next-Generation Flip Chip Materials and Processes
19. Chapter 18: Flip Chip Assembly and Underfilling
20. Chapter 19: BGA and CSP Rework: What is Involved?
21. Chapter 20: BGA Assembly Reliability
22. Chapter 21: Die Attach and Rework
23. Chapter 22: Liquid Encapsulation Equipment and Processes
24. Chapter 23: Molding for Area Array Packages
25. Chapter 24: Screen Printing and Stenciling
26. Chapter 25: Criteria for Placement and Processing of Advanced Packages
27. Chapter 26: Ovens in Electronics
28. Chapter 27: Process Development, Control, and Organization

Section 4: Economics and Productivity
29. Chapter 28: Metrics: The Key to Productivity
30. Chapter 29: Cost Estimating for Electronic Assembly

Section 5: Future
31. Chapter 30: The Future of Electronic Packaging
32. Chapter 31: The Future of SMT Process Equipment

33. Index

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Tags: Ken Gilleo, Area Array, Packaging Handbook, Manufacturing and Assembly